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Introduced |
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Description |
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Hot Air Leveling
OSP(eg. Entek)
Flash Gold
Immersion Gold, Tin & Silver
Gold Finger Plating OSP
HIGH FREQUENCY PCB (E. G. TELFON, ROGERS MAT'L BOARD)
Peelable Mase
Carbon Ink
Blind & Buried Vias Board
Aluminium Substrate
Back Panel 5. 0mm
No. Of Layers Available 2- 24
Min. Line Width 0. 10mm
Min. Line Spacing 0. 10mm
Min. Annual Ring PTH 0. 15mm
Non-PTH 0. 20mm
Min Hole Size PTH 0. 25mm
Non-PTH 0. 30mm
Hole Aspect Ratio 5
Min. Board Thickness Single & Double Sided 0. 3mm
Multilayer (4, 6, 8, 10) 0. 4mm, 1. 0mm, 1. 2mm, 1. 5mm
Max Board Size 450mm X 800mm
Solder Mask Pitch 0. 1mm
Hole Tolerance PTH +/- 0. 076mm
Non-PTH +/- 0. 05mm
Hole Position Tolerance +/- 0. 076mm
Outline Tolerance Routing +/- 0. 15mm
Punching +/- 0. 15mm
Thickness Tolerance MIL-P-13949 Class 2
V-Cut Tolerance Depth +/- 0. 15mm
Position +/- 0. 15mm
Gold Finger 5u " - 50u " |
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Contact Us |
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Company Name: |
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Multech Electronic Limited |
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Company Address: |
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C602, Shandong Building, Nanhai Rd, Nanshan, Shenzhen, Guangdong, China |
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Province/State: |
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Guangdong |
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Telephone: |
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86-755-26407175 |
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Full Name (Department): |
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Mrs. Jesse Ye () |
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